San Jose, Calif., February 7, 2017 — Integrated Device Technology, Inc. (IDT) (NASTIQ: IDTI) Introduces a new generation of 10Gbps millimeter-wave (mmWave) modems designed for wireless infrastructure in access and backhaul lines Carrier-level deployment. The IDT® RWM6050 is the industry's first highly integrated mmWave dual modem (PHY + MAC + ADC/DAC + beamforming) for fixed wireless broadband access, WTTx (wireless to edge), small base station backhaul, 5G services, etc. Applications and other emerging applications.
The RWM6050 will initially support the operating range in the 57-71 GHz band and will expand support in the future to cover other microwave and mmWave bands. It can be paired with the mmWave RF chipset to provide gigabit throughput over distances of a few hundred meters. Highly configurable RF interface for easy integration of wireless solutions.
Some key features of the RWM6050 include dual modem and mixed-signal front-end integration. These features provide a unique, cost-effective, energy-efficient solution. Each modem in the RWM6050 supports single-point-to-single-point and single-point-to-multipoint links, simplifying network planning and architecture for fixed wireless networks and 5G/LTE small base stations. IDT plans to offer a complete end-to-end solution with additional modems and companion transceivers.
“Using our long history and expertise to provide real-time interconnect solutions, including the unparalleled leadership of RapidIO for base stations, we are excited to announce the launch of the RapidWave product line, which will greatly expand our target market,†Sean Fan, vice president and general manager of IDT's Computing and Communications Division, said. "Broadband wireless access at gigabit speeds will not only address the bandwidth challenges of today's time-critical traffic in our wireless infrastructure, but will also help deliver many new services that are unimaginable today."
The main features of the RWM6050 include:· Dual Modem
· Gigabit data rate and link adaptive operation
· Phased array antenna and advanced beamforming
· Configurable radio interface
· Flexible transposition and channelization
· Integrated network synchronization
The RWM6050 is available in a compact 19 x 19 mm 484-FCBGA package in a standard 28nm CMOS process. IDT is expected to launch the RWM6050 sample and development kit in the second quarter of 2017.
About IDTIntegrated Device Technology, Inc. develops system-level solutions that optimize the application of its customers. IDT's broad range of fully mixed signal solutions for communications, computing, automotive and industrial applications including its market-leading electromagnetic frequency, real-time interconnect, wireless energy transfer, serial switching, interfaces, battery management ICs, sensor signal coordination Integrated circuit and environmental sensor products. Headquartered in San Jose, Calif., IDT has design, manufacturing, sales facilities and distribution partners around the world. IDT shares are traded on the NASDAQ Global Select Stock Market® under the symbol IDTI. For more information on IDT, visit www.IDT.com. Follow IDT on Facebook, LinkedIn, Twitter, YouTube, and Google+.
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