The LOMID selected for the EU H2020 program was launched in January 2015 and is managed by the Fraunhofer FEP scientist. The project aims to develop a new generation of large-area OLED microdisplays for virtual reality and augmented reality applications. The project will continue until the end of 2017.
The partners of the LOMID project aim to manufacture ultra-large (13&TImes; 21mm) flexible OLED microdisplays with a screen diagonal of 24.9mm and an acceptable yield of over 60%.
They hope to develop a rugged silicon chip design that supports pixel sizes of 11μm & TImes; 11μm high resolution (1200&TImes; 1920 – widescreen) with a pixel density of 2300 ppi and an extremely reliable manufacturing process for the backplane.
Mike Thieme, project manager for X-FAB, one of LOMID's project partners, said: "(We) develop affordable processes in CMOS silicon processes (eg based on 0.18 and 0.35μm lithography), with special attention to the top metal of the CMOS backplane The interface between the electrode and the subsequent OLED layer. In order to keep the cost of CMOS manufacturing low, many design rules have reached the limit."
They will also address challenges such as OLED microdisplay adaptability by achieving a 50mm bend radius. In addition to these new features, the durability of the device when bent must be guaranteed and comparable to rigid equipment.
To this end, they will improve the robustness of the OLED and by changing the packaging of the device to meet the stringent barrier requirements (water vapor transmission rate of 10 -6 g / dm 2) and provide adequate mechanical protection.
The LOMID project partners include X-FAB, which will produce CMOS backplane wafers for OLED microdisplays; these miniature displays will be used by the Limbak SL in virtual reality heads; research institute CEA-LeTI will develop Processes that achieve flexibility and proper packaging technology; Fraunhofer FEP focuses on integrated circuit design for backplane wafers; Leipzig University is dedicated to the development of inorganic transparent FET materials; Amanuensis is assisting organizations in coordination, promotion and promotional activities.
Dr. Beatrice Beyer will present the latest developments in the technology and project at the SID-ME Spring Meeting in Dresden, Germany, March 13-14, 2017.
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