As far as the design and application of microcontrollers in the industry is concerned, no industry has developed so rapidly in the field of industrial automation and control. Due to the increased automation of major manufacturing plants in China and other parts of Asia, new technologies are used to increase efficiency and therefore have a significant impact on manufacturing costs and product costs. While centralized control can improve the overall visibility of any particular manufacturing process, it may not be suitable for some critical applications where response delays and processing delays can cause failures.
This article will introduce several examples of this critical application, which will greatly affect the efficiency and reliability improvements for applications where intelligence and processing power are added to the process nodes. The new system-on-chip design provides the intelligence necessary to enable critical machining measurements and control of these parameters. This article will also discuss specific improvements in several SoC designs to address the design challenges and associated solutions for designing and selecting microcontrollers in today's rapidly growing industry.
From a historical point of view, it is not far from the age of craftsmen with very limited manufacturing knowledge to manufacture goods, such as shoes, hats, clothes, utensils and other items. The quality and quantity of the product depends on the skill of the particular craftsman and the number of people in the industry. The initial production line achieved an increase in production, which in turn led to an increase in the quality of the product. The manufacture of any given product is divided into simple separation steps, each step being repeated by a worker on the production line, who then transfers the semi-finished product to the next operator. Each operator only accepts limited training for a specific step, and the overall process is the responsibility of the foreman or supervisor. The use of unskilled or semi-skilled labor ensures a fast increase in quality, quantity, and availability of consumer products.
The separation steps of these craftsmen and early assembly line operators were then mechanized, which enabled the transfer of human capital (human) to control the increasingly localized local mechanized process pipeline. As central control increases, the visibility of any particular process step (especially at an early stage) is getting lower and lower, and the delay from the release of central control commands to actual execution becomes longer and longer. At some point, as a function of the generation and impact of response time delays associated with centralized control, the throughput of the entire process has a greater impact than the limits of each individual process step.
Current process optimization strategies range from analog to digital I/O (sensors and drivers), separation of process steps, and migration from a single centralized control topology to a distributed topology. As the need for intelligence needs to move closer to the process nodes and each step/task, large general-purpose workstations and processors give way to more specialized solutions such as microcontrollers and FPGA implementations.
As more processing and decision-making are decoupled from the local, and the client server central control model becomes a "peer-to-peer" distributed model, this will require a more advanced mixed-signal SoC. Equipment types such as PLCs and I/O modules, temperature/process controllers, CNC machines, and other such as flow/height measurements, encoders/parsers, gauges/indicators/limit alarms, motor protection, circuit breakers, etc. Applications will be the main application for further improvement of local intelligence, which will be implemented in a single chip that will integrate multi-channel, mixed-signal A/D conversion as well as dedicated h/w ​​processing and auxiliary MCU system management.
An example of the use of PLCs and I/O modules, motor drive controllers, and multi-axis controllers is a typical packaging application that includes an unwinding roller for winding material and a feed for conveying the items to be packaged. Feeding device, as well as some sealing locations and a conveyor that removes the item after it has been packaged.
Open loop control of such systems typically results in low throughput (efficiency) and poor quality when the registration information of the packaged material is poor, the tension of the packaging material is inconsistent, and the package is poor. The end result is increased unit cost due to additional QA inspection, monitoring, and product damage, not to mention the additional labor costs added to continuous monitoring (see Figure 1).
Figure 1: Schematic diagram of an open loop system in industrial control.
Closed-loop operation of the same system will increase the monitoring and feedback functions of the parameters, such as the torque of the roller, the speed and the amount of material remaining on the roller (length), the speed/tension of the feed and discharge conveyor, the temperature and pressure of the sealing roller, Registration/positioning of the product to be packaged and vibration of any key unit. The control of the main motor drive function (speed, tension and position) in the above example can be seen as a servo system that can be achieved by adding secondary measurements such as temperature and vibration.
In the servo system, closed loop operation is achieved by position, speed/angular velocity and current loop.
The position loop enables the motor to rotate to the desired position by outputting a speed/angular speed command with feedback information on the angle of rotation provided by the encoder or resolver. The speed loop controls this part of the loop to control the rotational speed of the motor set by the position loop, and the loop routes the feedback data from the encoder or resolver to turn it off. The speed loop output is the input to the current loop, which provides the motor with current to achieve the specified position and speed. The motor current value is fed back to the current loop, reducing the difference between the command and response values ​​to zero as much as possible. Teridian's patented single-converter technology architecture and applications in its 71M651x family of energy measurement devices for measuring single-phase or multi-phase power measurements are well suited for high-precision current measurements required for these types of applications.
A new device for the leakage tripper for circuit breaker and relay protection - the 71M6-03 is also well suited for motor protection in the packaging applications mentioned above. Utilizing Teridian's patented single-converter technology, the 71M6?03 integrates a 22-bit delta-sigma ADC, 6 primary current sensor inputs, digital temperature compensation, accurate voltage reference, 32-bit programmable computation engine, Timer, real-time clock (RTC), two UARTs, and a single-cycle 8-bit MCU.
Built-in digital di/dt integrator, this programmable device supports current transformers or Rogowski coils for any or all input channels and provides transient and delayed overcurrent, ground leakage, ground faults, arc faults Protective function. Moreover, the device may be configured to support an arbitrary number of conventional and conventional protection algorithms that are adaptable to a particular load on site. The programmable 32-bit Computation Engine (CE) receives and processes all sensor data from the 22-bit A/D converter while operating independently of the 8-bit MCU, which handles higher system-level management and communication tasks. This separation and management subsystem of the mixed-signal measurement subsystem provides high speed, high reliability and excellent dynamic range with no external interruptions or unnecessary processing overhead.
Integrating a multiplexed input into a 22-bit delta-sigma A/D converter results in the lowest cost, improved gain consistency, offset uniformity, reduced crosstalk, and increased design flexibility. In addition, Teridian's 71M8100 measurement controller devices are developed using the same high-performance architecture and can share many of the same features. In addition, three inputs can be used to sense and control secondary parameters such as temperature, vibration, process, and pressure. And humidity, etc.
All in all, by using a more specialized SoC solution to implement a closed-loop system, reducing latency, process intelligence and control can be moved from centralized mode to distributed mode, which not only improves efficiency and quality, but also reduces unit cost accordingly. Further, there are opportunities for innovation that further enhance industrial automation, protection and control, and can be addressed with the same basic chip-scale architecture.
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