"As the demand for high-power products with more than 1W light source increases, the future high-power surface light source market will be one of the mainstream LED packaging markets." The person in charge of the same party said that the innovative integrated module and COB light source R&D and production will be the competitive red sea in the high-power market in this wave of market trends.
After several generations of product improvement and replacement, the high-end lighting market and mass-produced, large-scale production are becoming the key to the competition of packaging manufacturers at this stage. At present, the same party is working on the development of a high-combination certified C-series ceramic COB and a standardized COB light source.
It is understood that since March this year, with the substantial increase in COB product shipments, the overall order growth of the same party began to exceed the capacity growth.
“Now the packaging market is changing rapidly. The so-called superior performance can't be explained simply by new models and new technologies.†The above-mentioned person in charge said that instead of being able to make a unique price/performance ratio for a certain device model, it will be even more Have an advantage. “For example, high-power lamp beads can achieve the highest light efficiency, ultra-fast matching speed, good light color effect and reliability.â€
"The overall market of LED has been smashed from the previous two years to the present, and the overall market is gradually improving. The LED industry is entering a high-speed integration period, and the market positioning of packaging companies is particularly important." The same party is positioned in the middle and high-end. In the details, we will focus on creating a higher cost performance and reliability. In this period of time when many companies are looking for a new blue ocean and the industry pattern changes, the same party wants to stick to it in many packaged device factories and stand out.
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