According to the news on March 7, in December last year, Google (Google) and industry manufacturers jointly launched the 10X10G 100Gbps optical transceiver module multi-source agreement (MSA). These manufacturers claim that their joint 10X10 MSA protocol has been successfully used in existing 100Gbps optical communication equipment. When developing multi-source, low-cost optical communication products (such as 100G Ethernet and OTU4) in the future in the optical communication field, the 100G MSA specification will be referred to.
The 10X10 multi-source protocol requires that 10 electrical signal channels with a rate of 10 Gbps be directly grafted onto 10 lasers with a rate of 10 Gbps. The transmission of the first laser module needs to pass through a single-mode fiber, and the distance must reach 2 kilometers. MSA members said that they will gradually extend the transmission distance of 2 kilometers to 10 kilometers, and at the same time, they will develop higher-density communication modules.
It is reported that the 10X10 MSA is a product of the bandwidth requirements of some high-speed optical network potential users in the industry. As an advocate, Google will develop 100G Ethernet products and transmit them through single-mode fiber. The transmission distance is 2 kilometers, which is cheaper than IEEE 100GBase-LR4 PMD. However, IEEE 100GBase-LR4 PMD requires that four electrical signals with a rate of 25 Gbps be directly grafted onto four lasers with a rate of 25 Gbps. The initial cooperative members include: Google, Brocade, JDSU, and Santur. MSA now has 18 members, including: Huawei, Facebook, BTI Systems, AMS-IX, MRV, EXFO, Enablence, CyopTIcs, AFOP, Oplink, Hitachi Cable America, Kotura, Effdon, and CorTIna Systems.
Electronic design is also trying to reduce its size while continuously improving the performance of the whole machine. From mobile phones to smart small portable products, small is always the same pursuit. High-density integration (HDI) technology enables end-product design to be more compact while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured using a build-up method. The more times the layers are stacked, the higher the technical grade of the board. Ordinary HDI boards are basically one-time laminate, high-order HDI uses two or more layers of technology, and adopts advanced PCB technology such as stacking holes, plating holes, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital video cameras, IC carrier boards, etc.
Pcb Hdi,Hdi Board,Hdi Pcb Design,Hdi Pcb Technology
Chuangying Electronics Co.,Ltd , https://www.cwpcb.com