Basically, existing OLED luminescent materials can be roughly classified into fluorescent and phosphorescent materials according to the principle of illuminating. The luminous efficiency of the fluorescent material is at most 25%, and the phosphorescent material is 100%. However, the luminous efficiency of the new material when excited by light is as high as that of the phosphorescent material. According to Anda Katsuya, a professor at Kyushu University, the president of OPERA, this is because of the phenomenon of "thermally active delayed fluorescence (TADF)" in new materials.
While maintaining high efficiency of illumination, a wide selection of luminescent colors is also a major feature of this material. OPERA has produced organic EL panels with luminescent colors such as blue, green, yellow-green, yellow, and orange. The yellow luminescent material has a luminous efficiency of only 26 ± 1% when excited by light, but the luminous efficiency of the green and yellow-green luminescent materials is 74 to 94%, and the blue and orange luminescent materials are about 47%.
Electronic design is also trying to reduce its size while continuously improving the performance of the whole machine. From mobile phones to smart small portable products, small is always the same pursuit. High-density integration (HDI) technology enables end-product design to be more compact while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured using a build-up method. The more times the layers are stacked, the higher the technical grade of the board. Ordinary HDI boards are basically one-time laminate, high-order HDI uses two or more layers of technology, and adopts advanced PCB technology such as stacking holes, plating holes, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital video cameras, IC carrier boards, etc.
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